Abstract
In recent years, thin-film thermocouple (TFTC) array emerged as a versatile candidate in micro-/nanoscale local temperature sensing for its high resolution, passive working mode, and easy fabrication. However, some key issues need to be taken into consideration before real instrumentation and industrial applications of TFTC array. In this work, we will demonstrate that TFTC array can be highly scalable from micrometers to nanometers and that there are potential applications of TFTC array in integrated circuits, including time-resolvable two-dimensional thermal mapping and tracing the heat source of a device. Some potential problems and relevant solutions from a view of industrial applications will be discussed in terms of material selection, multiplexer reading, pattern designing, and cold-junction compensation. We show that the TFTC array is a powerful tool for research fields such as chip thermal management, lab-on-a-chip, and other novel electrical, optical, or thermal devices.
Highlights
One of the major bottlenecks of fast development in the modern electronics industry is heat
If built-in thermal sensors are required for time-resolvable solutions in a solid device, such as in integrated circuit (IC) chips, micro-electro-mechanical system, a lab-on-a-chip, or a flexible printed circuits, it seems that only stripe-shaped resistive sensor [6] and thin-film thermocouple (TFTC) are left in the candidate list
Time-resolved temperature mapping can be drawn from TFTC array readings
Summary
One of the major bottlenecks of fast development in the modern electronics industry is heat. Managing the high heat flux generated by billions of transistors in an integrated circuit (IC) is the main challenge. Thermal measurement at microscale and nanoscale is a technical challenge. When both high spatial resolution and high temperature sensitivity are required, only a few approaches, such as scanning thermal microscopy [2], luminescent nanoparticles, and infrared thermography [3,4,5], remain in the list of suitable candidates. If built-in thermal sensors are required for time-resolvable solutions in a solid device, such as in IC chips, micro-electro-mechanical system, a lab-on-a-chip, or a flexible printed circuits, it seems that only stripe-shaped resistive sensor [6] and thin-film thermocouple (TFTC) are left in the candidate list. The passive nature of a thermocouple makes it superior to a resistive thermal sensor (usually made of metal or semiconductors)
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