Abstract

Low-temperature processed oxide thin-film transistors (TFTs) have been developed by the process of solution-processed metal oxide films using deep ultraviolet (UV) irradiation, although they still suffer from relatively poor electrical performance and severe electrical and chemical instability. This UV coating solution essentially involves chemical damage from acidic or basic precursor ligands; therefore, the top-gate and dual-gate TFTs suffer structurally inherent chemical damage, which limits the freedom of process design. An engineering concept solution using the four functional components of solvent, precursor, stabilizer, and additive was suggested for UV solution coating of high-k zirconium oxide (ZrOx). Here the proposed solvent, stabilizer, precursor, and additive include polar-aprotic N,N-methylformamide, zirconium acetylacetonate, ethanolamine, and oleic acid for polar-aprotic solution, effective photolysis, complete precursor dissolution, and high densification, respectively. The ultrathin ZrOx (15 nm) revealed a low leakage current density of <10−11 mA/cm2 at 1 MV/cm, good breakdown voltage, and a constant capacitance of approximately 260 nF/cm2 at 1 MHz. Similar transfer characteristics of both the bottom and top gates, and a field-effect mobility of 24 cm2/V, without degradation of subthreshold swing and threshold voltage values in the dual-gate, were involved in the chemically durable process and the dense coating conditions of ZrOx, regardless of the IZO and ZrOx stacking sequence.

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