Abstract

Lead zirconate titanate (PZT) thin films stand for a prominent technological brick in the field of microsystems. The recent improvements of their manufacturability combined with excellent piezoelectric properties have enabled their introduction in industrial clean rooms all around the world. These films require annealing temperatures beyond 600 °C to crystallize in the desired perovskite phase, which exhibits outstanding piezoelectric coefficients. This temperature requirement forbids large application fields such as flexible electronics, smart glass but also system-on-chip approaches. Decreasing the annealing temperature of PZT films would therefore spread further their potential usage to other applications. The purpose of this paper is to provide the reader with a comprehensive review of the different techniques available in the literature to process piezoelectric PZT thin films at temperatures compatible with semiconductors (450 °C), smart glass (400 °C), or flexible electronics (350 °C). We first present the typical ferroelectric and piezoelectric properties of PZT films. The different deposition techniques and growth mechanisms of these films are then reviewed with a focus on thermodynamics. Then, all the low temperature processes are detailed, such as seeding effects, the modification of deposition parameters in vapor-phase deposition, special annealing technologies assisted with UV, lasers, flash lamps, microwave radiations or high-pressure, a focus on the hydrothermal method, and finally what is called solution chemistry design with notably combustion synthesis. Transfer processing is also detailed, as an alternative way to this low temperature approach. An outlook of future applications enabled by these innovative techniques is finally provided.

Highlights

  • The purpose of this paper is to provide the reader with a comprehensive review of the different techniques available in the literature to process piezoelectric PZT thin films at temperatures compatible with semiconductors (450 C), smart glass (400 C), or flexible electronics (350 C)

  • In the case of PZT films grown by physical vapor deposition (PVD), deposition parameters such as gas pressure, gas atmosphere, and deposition temperature play a strong role on the final crystallization temperature

  • The seeding method needs extremely long annealing time to crystallize PZT films, but this is an effective way to scitation.org/journal/are assist other low-temperature processing to obtain the desired orientation and to decrease crystallization temperature

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Summary

INTRODUCTION

Thanks to their large piezoelectric response, ferroelectric oxide films are considered as one of the most promising approaches to achieve small-scale integration into piezoelectric microelectromechanical systems (MEMS) for high-sensitivity sensors and low-power actuators, such as pressure sensors,[1,2,3,4,5,6,7] accelerometers,[5,8,9,10,11,12,13,14,15] energy harvesters,[16,17,18,19,20,21,22,23] micromirrors,[24,25,26,27,28,29] micropumps,[30,31,32] microswitches,[33] piezoelectric haptics,[34,35] and inkjet printheads.[36]. More and more semiconductor companies are devoting efforts to the development of PZT-based MEMS (observed in Fig. 1).[30,37,38,39,40,41,42,43] the technological bottleneck for integration of MEMS devices directly on CMOS devices is the high-temperature processing of PZT films.[44] there is a trade-off between piezoelectric properties and deposition/crystallization temperature. A typical processing temperature for a desired well-crystalline PZT thin film is 550–650 C with physical vapor deposition (PVD) and 650–750 C with chemical solution deposition (CSD) This is substantially higher than the maximum thermal budget of CMOS devices (450 C).[45,46,47] When annealed below this specific processing temperature, PZT typically crystallizes into a non-ferroelectric undesired pyrochlore or fluorite phase, instead of the ferroelectric (and piezoelectric) perovskite structure. Some insights about new challenges and future prospects have been exposed

FERROELECTRIC AND PIEZOELECTRIC PROPERTIES OF PZT FILMS
Deposition technologies
Thermodynamics and kinetics of nucleation and growth
LOW-TEMPERATURE PROCESSING
Bottom electrode influence on crystallization
Effect of the seed layer and nano-seeds
Modification of deposition parameters for vapor-phase deposition
Special annealing technologies
UV photo-annealing
Laser annealing
Flash lamp annealing
Microwave annealing
High-pressure annealing
Solution chemistry design
Controlling the compositions and homogeneity in PZT solutions
TRANSFER PROCESSING
APPLICATIONS OF LOW-TEMPERATURE PROCESSING
MEMS-CMOS integration
Flexible piezoelectric energy harvesters
Findings
CONCLUSION AND OUTLOOK
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