Abstract

Spin-crossover (SCO) materials display many fascinating behaviors including collective phase transitions and spin-state switching controlled by external stimuli, e.g., light and electrical currents. As single-molecule switches, they have been fêted for numerous practical applications, but these remain largely unrealized-partly because of the difficulty of switching these materials at high temperatures. We introduce a semiempirical microscopic model of SCO materials combining crystal field theory with elastic intermolecular interactions. For realistic parameters, this model reproduces the key experimental results including thermally induced phase transitions, light-induced spin-state trapping (LIESST), and reverse-LIESST. Notably, we reproduce and explain the experimentally observed relationship between the critical temperature of the thermal transition, T1/2, and the highest temperature for which the trapped state is stable, TLIESST, and explain why increasing the stiffness of the coordination sphere increases TLIESST. We propose strategies to design SCO materials with higher TLIESST: optimizing the spin-orbit coupling via heavier atoms (particularly in the inner coordination sphere) and minimizing the enthalpy difference between the high-spin (HS) and low-spin (LS) states. However, the most dramatic increases arise from increasing the cooperativity of the spin-state transition by increasing the rigidity of the crystal. Increased crystal rigidity can also stabilize the HS state to low temperatures on thermal cycling yet leave the LS state stable at high temperatures following, for example, reverse-LIESST. We show that such highly cooperative systems offer a realistic route to robust room-temperature switching, demonstrate this in silico, and discuss material design rationale to realize this.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.