Abstract

Self-assembled molecular monolayer (SAMM) doping on semiconductors has been widely appraised for its advantages of doping nanoelectronic devices for applications in the complementary metal-oxide-semiconductor transistor (CMOS) industry. However, defects introduced by SAMM-doping will limit the performance of the devices. Previously, we have found that SAMM-doping can bring carbon impurities into the silicon substrate and these unwanted carbon impurities can deactivate phosphorus dopants by forming an interstitial carbon (Ci)–substitutional phosphorus (Ci–Ps) complex. Herein, to develop a defect-free SAMM-doping process, the generation and annihilation of Ci-related defects are investigated by extending the thermal annealing time from 2 to 10 min using secondary ion mass spectrometry and deep-level transient spectroscopy. The results show that the concentration of Ci-related carbon defects is lower after a longer time of thermal annealing, although a longer annealing time actually introduces a higher concentration of carbon impurities into Si. This observation indicates that interstitial carbon evolves into substitutional carbon (Cs) that is electrically inactive during the thermal annealing process. A defect-free SAMM-doping process may be developed by an appropriate post-annealing process.

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