Abstract
MHM (Metal Hard Mask) AIO (All-In-One) etch is one of key BEOL (Back-End-Of-Line) processes for 40/45nm technology node and beyond. In this work, we focus on some key issues and solutions that we encountered during 40nm MHM AIO etch process development in HLMC. Main issues including: TiN thickness optimization, trench profile optimization, kink profile optimization, chamfer profile control, TixFy residue issue, via profile control, trench Bottom roughness issue, via bottom integrity control etc. For above process challenges, the article gives detail analysis and then provides final solutions which can meet all process requirements after balancing and optimizing all process parameters under current hardware’s conditions.
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