Abstract
A numerical model has been made to determine the effect of various geometric and thermal variables. The model consists of the following three blocks: (1) the the entire furnace system in which entire temperature distributions were calculated considering the effects of radiative heat exchange and gas flow; (2) a crystal and melt system in which temperature distributions and the crystal/melt interface were calculated, (3) thermal stress analysis by which resolved shear stress is obtained. Calculated results were in good agreement with experimental results; the temperature response to the change of heater power, the crystal/melt interface shape which was observed from growth striations and etch-pit densities on 4 inch diameter (100) oriented GaAs wafers.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
