Abstract

The total dose radiation response of nitrided and non-nitrided n-type 4H-SiC is reported for metal oxide semiconductor capacitors exposed to 10-keV X-rays under positive bias. The radiation response is affected strongly by differences in the SiC band gap and interface/near interface SiO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> trap density from typical Si MOS devices. Significantly higher net trapped positive charge densities were observed in nitrided n-SiC MOS capacitors compared to the non-nitrided samples. The mechanisms contributing to the differences in the charge trapping in these devices are discussed. Differences in the interfacial layer between SiO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> /Si and SiO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> /SiC are responsible for the observed dissimilarities in charge trapping behavior

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