Abstract
On May 22, 2024, Toray Industries, Inc., announced that it recently commercialized a mold release film for advanced semiconductor applications that is free of per- and polyfluoroalkyl substances (PFAS; see Glossary note 1). The film's material reportedly does not contain the organic fluorine compounds that European and other countries are looking to regulate. The film could reportedly help improve operational rates in advanced semiconductor manufacturing by slashing problematic mold contamination by more than 80%.
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