Topology optimization of orthotropic multi-material microstructures with maximum thermal conductivity based on element-free Galerkin method

Abstract

A topology optimization model for periodic heat transfer microstructure with orthotropic multi-material is established by using the element-free Galerkin method (EFGM) and alternating active-phase algorithm (AAPA). The maximum thermal conductivity is chosen as the opposite number of objective function, and the 3-D printing of the microstructure and heat transfer analysis are performed to validate the proposed model. The effects of the number of multi-material categories, the initial distributions of multi-material, the thermal conductivity factor, and the multi-material off-angle on the topological configuration with maximum thermal conductivity are studied. The results show that the multi-material topological configuration is comprised the material with a higher thermal conductivity as the primary frame and surrounded by the material with the lower thermal conductivity. The initial distribution of multi-material has a little impact on the maximum thermal conductivity. The alteration of the thermal conductivity factor will contribute to the accumulating of materials in the direction of the higher thermal conductivity, and the material stacking direction is more inclined to the direction of multi-material off-angle. The reasonable values of multi-material thermal conductivity factor is suggested to be 2–4 and multi-material off-angle is suggested to be 0°–30° and 60°–90°.