Abstract
The homogeneous plate type molybdenum copper alloy (Mo70Cu30) heat sink is the heat dissipation component of the main heating elements such as the T / R module power amplifier chip in the phased array radar at this stage. Through the finite element simulation based on Ansys Workbench, the topology optimization design of the heat sink structure size can be realized. Research shows that heat transfer on the heat sink is a combination of in-plane expansion and vertical expansion: when the length of the heat sink exceeds 2.5 times the chip length and the width of the heat sink exceeds 2.5 times the chip width, the heat is fully transferred in the plane direction. The thickness of the heat sink has no obvious effect on the temperature rise of the chip. In the engineering design process, the process-ability and processing cost can be considered.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
