Abstract
Optimizing the heat source distribution is an effective strategy to enhance the heat dissipation in electronic devices. In this paper, a topology optimization (TO) scheme with a penalty factor between 0 and 1 is developed to solve the volume-to-point heat source distribution. The topology-optimized heat source always lies around the heat sink with continuous design, and the isotherms show semicircular arcs with the semicircle center located at the heat sink. Compared with other optimization methods, the current TO method obtains better designs approximate to the theoretical optimal solution with higher cooling performance and lower computational cost. Moreover, an equivalent distance function reflecting the distance between the heat source and the heat sink is introduced to evaluate the performance of different heat source distributions. Topology-optimized designs and mathematical analyses show that reducing the equivalent distance between the heat source and the heat sink is an effective way to enhance heat transport. This work extends the application of the TO method and deepens the understanding of the optimization of heat source distribution.
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