Topology Optimization and Material Selection of Cooling Fin Structure in Submarine Data Center

Abstract

The optimization of fin heat dissipation structure has always been an interesting topic, and a good heat dissipation structure is conducive to the full function of electronic devices. In order to obtain the best heat dissipation structure, the COMSOL density penalty method and heat conduction model are adopted to study the topology optimization model of heat dissipation structure. On the basis of circular fins, the material types of fins are kept unchanged, and the optimized fins are obtained after topology optimization under various working conditions. The contact area and average temperature of the topological fin and circular fin are compared. The simulation results show that the topology fin has better heat dissipation performance when the heat source power and ambient temperature are similar. Compared with the circular fin profile, the contact length of the topological fin increases by 48%, and the average temperature is reduced by 14.7K. After obtaining the best heat dissipation structure, the entropy weight method is adopted to select the best heat dissipation material of heat dissipation fins and determine that the best heat dissipation material is lead.