Abstract
The topographical and microstructural features of Cu-Sn coatings deposited by magnetron sputtering using alloy target of Cu-7.8%Sn and Cu-74%Sn onto ferritic stainless steel substrates with a temperature gradient were investigated by means of optical and scanning electron microscopy. Depending on the substrate temperature the alloy film forms by a vapour → solid process or a vapour → liquid process with solidification after substrate cooling. In between a mixed mechanism of vapour → liquid → solid occurs during condensation in the temperature ranges 990–1170 K and 460–790 K for coatings deposited by sputtering of Cu-7.8%Sn and Cu-74%Sn targets respectively. The copper-rich condensate formed in the temperature range 370–1220 K consists of a single-phase α solid solution of tin in copper. Its lattice parameter decreases with increasing temperature mainly because of the decreasing tin content. The film obtained by sputtering a Cu-74%Sn target has a two-phase η′-Cu 6Sn 5 plus tin structure independently of the deposition temperature.
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