Topographic Changes in Ni-5at.%W Substrate After Annealing Under Conditions of Buffer Layer Crystallization

Abstract

Abstract Topographic changes have been studied in an annealed Ni-5at.%W substrate with a strong cube texture before and after additional annealing reproducing conditions of buffer layer crystallization. It was found that during this additional annealing the microstructure slightly coarsened and that the average depth of grain boundary grooves increased considerably for certain boundary types. Grooves at general high angle boundaries and Σ3 boundaries with large deviations from the ideal twin relationship were found to be more sensitive to the additional heat-treatment than grooves at low angle and true twin boundaries. Average groove widths increased for all boundary types. Despite the observed changes in the extent of grain boundary grooving, the mean surface roughness was almost identical before and after the additional annealing.