Abstract
Tool breakage monitoring is crucial to automation fabrication, especially for high-density hole machining, such as PCB (Printed Circuit Board). A tool breakage feature extraction method in PCB micro-hole drilling is presented in this paper. The vibration signal is analyzed by wavelet transform. The decomposed signals energy ratio at each frequency band is computed as monitoring features. The monitoring performance of different features selection is given. The vibration signals are observed to provide the capability in distinguishing micro drill breakage with proper features extraction and classifier design.
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