Abstract
Abiotic stress is a limiting factor for plant growth and development. The use of arbuscular mycorrhizal fungi can reduce the negative effects of abiotic stress. This study aimed to determine the tolerance of <em>Nauclea orientalis</em> inoculated with mycorrhizae to drought and waterlogging stresses. This research was carried out at the Indonesian Mycorrhizal Association’s greenhouse and Forestry laboratory University of Halu Oleo in Kendari City, Southeast Sulawesi Province, Indonesia, from March to June 2019. The study used a factorial completely randomized design consisting of two factors. The first factor was Arbuscular Mycorrhizal Fungi (AMF) inoculations (A) consisting of a control, AMF types of <em>Acaulospora</em> <em>sp.-1</em>, and <em>Claroideoglomus etunicatum. </em> The secod factor was environmental stress treatments (B) consisting of a control, soil moisture 25% of field capacity, 50% of field capacity, inundated as high the polybag (9 cm high) and inundated over the polybag. The results showed that local AMF was effective in improving plant growth. Interaction between inoculation of <em>Acaulospora</em> sp.-1 and environmental stress significantly increased AMF colonization on the <em>N. orientalis</em> roots. Inoculation of <em>C.etunicatum</em> significantly improved the <em>N. orientalis</em> growth. The treatment of drought stress with a field of 50% field capacity negatively influenced plant dry weight and the relative growth of the <em>N. orientalis</em>.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.