Abstract
Polyimides are attractive candidates for advanced electronic and space applications due to their high performance thermal and mechanical properties. However, the typical intractability and insolubility of polyimides has been a disadvantage. Utilization of the soluble intermediate amic acid can, to some extent, circumvent this problem. However, drawbacks to this approach include the hydrolytic instability of the amic acid and the liberation of water during its subsequent thermal cyclization. Residual stress build-up at the imide-substrate interface may occur due to swelling and drying cycles caused by the loss of water and solvent. In addition, the liberation of volatiles from a polyimide adhesive or coating can lead to the creation of voids which may significantly detract from mechanical properties. Polymeric adhesives must flow in order to provide good wetting of adherend surfaces and consolidation of the bond components. Thus, fully imidized, melt and solution processable, high Tg aromatic polyimides are of great interest.
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