Abstract

With this study, we propose a method to image the tip crack on transparent materials by using digital holographic microscopy. More specifically, an optical system based on Mach–Zehnder interference along with an inverted microscopy (Olympus CKX53) was used to image the tip crack of Dammar Varnish transparent material under thermal excitation. A series of holograms were captured and reconstructed for the observation of the changes of the tip crack. The reconstructed holograms were also compared temporally to compute the temporal changes, showing the crack propagation phenomena. Results show that the Dammar Varnish is sensitive to the ambient temperature. Our research demonstrates that digital holographic microscopy is a promising technique for the detection of the fine tip crack and propagation in transparent materials.

Highlights

  • Fracture mechanics of crack propagation behavior under static and fatigue loads is an important subject

  • The cracks and deterioration of transparent material were detected by Digital Holographic Microscopy (DHM)

  • The tip crack propagation of the material is clearly shown through the experimental results

Read more

Summary

Introduction

Fracture mechanics of crack propagation behavior under static and fatigue loads is an important subject. Over the past few years, mechanical failures have led to a growing awareness of the impact of cracks and stress in manufacturing parts on their failure strength. It is known that the crack bearing pressure or thermal load has an important effect on crack propagation. The number of cracks caused by environmental influences is significant; by considering this relationship, the influence of pressure or thermal load on crack growth behavior can be evaluated by analyzing the stress intensity (or thermal) and the direction and number of crack growths [1,2]. P.F. Gao investigated the deformation in the fatigue crack tip plastic zone and its role in the fatigue crack propagation of a titanium alloy with a tri-modal microstructure by combining scanning electron microscopy and electron backscatter diffraction.

Methods
Results
Conclusion
Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.