TiO2 film on copper: Effects of the temperature and the intermediate layer of nickel on adhesion and photocatalytic activity

Abstract

AbstractThe deposition of titanium dioxide (TiO2) on copper (Cu) substrate was performed by electrophoresis in an aqueous medium. The samples obtained were then calcined at temperatures ranging from 300°C to 550°C with a pitch of 50°C. After calcinations at 500°C and 550°C, the TiO2 film blackened and detached from the substrate. The XRD analyzes confirmed the formation of copper oxide at 350°C. The photocatalytic test carried out with amido black 10B (AB) under ultraviolet (UV) radiations showed that the percentage of discoloration decreases by increasing the calcination temperature. Moreover, the results obtained by the scratch test demonstrated that the samples exhibited poor adhesion. In order to improve the film adhesion and to avoid the formation of copper oxide, we introduced a nickel (Ni) layer. Afterward, the TiO2/Ni/Cu sample was calcined at 550°C, which allowed eliminating the forms of copper oxide, on the one hand, and improving the adhesion of the film, on the other hand. The rate of AB discoloration with TiO2/Ni/Cu sample was 25.54%, which is close to that of TiO2/Cu calcined at 450°C.