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Abstract
We report for the first time the existence of the titanium nitride chloride (TiNCl) compound in low-temperature (400 °C) low-pressure chemical vapor deposition (LPCVD) TiN films deposited using TiCl4/NH3 chemistry. Thin-film x-ray diffraction and Auger electron spectroscopy was used in the film characterization. Physical, chemical, and electrical properties of the resulting low-temperature LPCVD TiN films are discussed.
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