Abstract
Contact angle measurements on silicon-nitride substrates were conducted on tin-based alloys, containing titanium and zirconium, to determine the suitability of these alloys as filler metals for low-temperature joining of ceramics. Titanium-containing alloys exhibited excellent wettability characterized by contact angles less than 20 deg, whereas the Zr-containing alloys exhibited contact angles around 50 deg. The superior wettability of the Sn−Ti alloys is attributed to the higher activity coefficient of Ti in Sn−Ti alloys. The liquidus temperature of the Sn−Ti alloys is in the 400°C to 600°C range. Hence, these alloys are expected to reduce the residual stress problem.
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