Abstract
AbstractWe investigated the mode II fracture toughness (KIIc) with time and temperature dependence of the bisphenol A type of epoxy resin. We performed an asymmetric four‐point bending test under various conditions of temperature and displacement rate. We found that KIIc strongly depended on the displacement rate and the temperature, even at room temperature. Moreover, it was governed by the time–temperature equivalence principle in regard to the fracture time. The time–temperature dependency of KIIc was similar to that of the loss modulus (E″), and the transition of brittle to ductile fractures occurred nearly simultaneously when E″ peaked. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 96: 51–55, 2005
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