Abstract
Single and coupled uniform and nonuniform interconnects associated with high speed electronic packages are characterized by calibrated time domain reflection and transmission (TDR/measurements. One- and two-port calibration techniques have been developed in time domain and are used to construct lumped, distributed as well as hybrid circuit models for interconnects and associated packages by using basic dynamic deconvolution techniques. Methods for calibration, de-embedding and general distributed model extraction are presented together with the measured data and equivalent circuit models for several test structures. These include uniform and nonuniform isolated and coupled interconnects, discontinuities and a Triquint multilayered ceramic package. The accuracy of the circuit models is ascertained by comparing the simulated time domain response with the measured data.
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