Abstract
A comparative combined stress-induced reliability issues between Auger hot carrier and ionizing radiation in double polysilicon bipolar transistor is investigated. The observed differences in the low-frequency noise spectra of devices with different stressing conditions could be interpreted as the differences in the defects-related noise contributions. Low-frequency noise and electrical performance degradation results show that Auger hot carriers greatly induce the atomic hydrogen depassivating the dangling bonds in grain boundaries of emitter polysilicon. However, ionizing radiation damage occurs both at SiO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> /Si interfaces and in the oxide layer. 1/f noise characteristics indicate that these two damages have different time dependences.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
