Abstract
The time‐averaged current distribution over the surface of a rotating‐disk electrode is calculated under conditions of periodic current reversal by simultaneously solving the transient‐convective‐diffusion equation and Laplace's equation. The calculated results compare well with experiments performed using the copper/copper sulfate system. The grid search technique is used to determine the optimum plating conditions in terms of uniform thickness of electrodeposits by varying the duty factor and the ratio of anodic to cathodic current density.
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