Ti film deposition process of a plasma focus: Study by an experimental design

S Davis,L Soto,M J Inestrosa-Izurieta,J Moreno

doi:10.1063/1.4997877

Abstract

The plasma generated by plasma focus (PF) devices have substantially different physical characteristics from another plasma, energetic ions and electrons, compared with conventional plasma devices used for plasma nanofabrication, offering new and unique opportunities in the processing and synthesis of Nanomaterials. This article presents the use of a plasma focus of tens of joules, PF-50J, for the deposition of materials sprayed from the anode by the plasma dynamics in the axial direction. This work focuses on the determination of the most significant effects of the technological parameters of the system on the obtained depositions through the use of a statistical experimental design. The results allow us to give a qualitative understanding of the Ti film deposition process in our PF device depending on four different events provoked by the plasma dynamics: i) an electric erosion of the outer material of the anode; ii) substrate ablation generating an interlayer; iii) electron beam deposition of material from the center of the anode; iv) heat load provoking clustering or even melting of the deposition surface.

Highlights

Depositing material through a pulsed plasma device, such as a PF has some special features over other methods, including a high deposition rate, an energetic deposition process, the ability to operate at high frequency and being characterized by low operating costs, which makes them very appropriate for the generation and treatment of technological materials
The plasma dynamics of a PF starts when a high-voltage pulse is applied between the electrodes through a spark-gap
The sheath collapses in the axis to form a dense column of plasma of high temperature and high density called pinch

Summary

Introduction

There is evidence of the increasing interest regarding the use of PF type plasmas and their various applications. Specially they have attracted great interest on the possible applications in different technological fields where the idea that this device is a source of high density plasma and temperature, and a rich source of high-energy ions usable for modification of surface properties of thin films deposition, doping of semiconductors and production/coating of nanocomposites, is profitable. Depositing material through a pulsed plasma device, such as a PF has some special features over other methods, including a high deposition rate, an energetic deposition process, the ability to operate at high frequency and being characterized by low operating costs, which makes them very appropriate for the generation and treatment of technological materials. these methods still require further studies to improve the quality of the resulting surfaces. To achieve this, it is extremely important to first get a good understanding of the processes involved in this method of production/modification of materials.The plasma dynamics of a PF starts when a high-voltage pulse is applied between the electrodes through a spark-gap. Depositing material through a pulsed plasma device, such as a PF has some special features over other methods, including a high deposition rate, an energetic deposition process, the ability to operate at high frequency and being characterized by low operating costs, which makes them very appropriate for the generation and treatment of technological materials.. Depositing material through a pulsed plasma device, such as a PF has some special features over other methods, including a high deposition rate, an energetic deposition process, the ability to operate at high frequency and being characterized by low operating costs, which makes them very appropriate for the generation and treatment of technological materials.17–20 These methods still require further studies to improve the quality of the resulting surfaces.. This plasma column is disrupted due to plasma instabilities, generating a plasma burst of high

Methods

Results

Conclusion