Abstract

In this letter, we demonstrate an efficient way to modulate the threshold voltage ( ${V} _{\text T}$ ) of InGaAs high-electron-mobility transistors (HEMTs) through forming the fin-shaped channel. The gate metal is directly deposited on this fin-shaped channel and thus can be regarded as a “Schottky-gate Fin-HEMT.” The device exhibits great fabrication stability and electrical characteristics. The 2- $\mu \text{m}$ gate-length device exhibits positive ${V} _{\text T}$ shift of 2.98 V from planar to fin device with a fin width ( ${W}_{\text {FIN}}$ ) of 54 nm, and an enhancement-mode operation is achieved when ${W}_{\text {FIN}}$ is less than 74 nm. Performances are enhanced both for ON-and OFF-state with ${W}_{\text {FIN}}$ scaling down to the regime of about 100 nm. The modulation mechanism can be attributed to the band bending at metal–semiconductor interface of the side gate, which is verified by the TCAD simulation, and thus depletes the carriers channel much more efficiently than top gate control.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.