Abstract

This paper analyzes and compares the stability, margin, performance, and variability of ultrathin-body (UTB) SOI 6T SRAM cells operating near the subthreshold region with different threshold voltage (V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">th</sub> ) design. Our results indicate that UTB SOI 6T SRAM cell using low V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">th</sub> devices (|V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">th</sub> | = 0.19 V) shows a comparable read static noise margin (RSNM), 41% improvement in σRSNM, 84% improvement in write static noise margin (WSNM), and 67% improvement in σWSNM as compared with the case using higher V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">th</sub> devices (|V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">th</sub> | = 0.49 V). As V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">th</sub> decreases (work function moves to the band edge), the “cell” access time improves significantly with correspondingly higher standby leakage. For low V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">th</sub> devices (|V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">th</sub> | = 0.19 V), it is shown that lowering bit-line precharge voltage by 50 mV reduces the standby leakage by 20%. Our study suggests that the lower V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">th</sub> devices operating slightly into super-threshold region improve the stability/variability significantly and offer higher performance for ultralow voltage SRAM applications.

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