Three-dimensional stress analysis of O-ring under uniform squeeze and internal pressure by photoelastic experimental hybrid method

Abstract

Until now, it is known that stresses on the plane (y-z plane) perpendicular to the circumferential direction (x axis) of Oring exist and stresses on the plane (x-y plane and x-z plane) parallel to the circumferential direction of O-ring does not exist when O-ring is under uniform squeeze rate and internal pressure. But it was known that stresses of x-y plane and xz plane of O-ring under uniform squeeze and internal pressure were existed by this research. To analyze 3 dimensional stress distributions of O-ring under those loadings, stress distributions of every plane should be analyzed. Therefore, photoelastic experimental hybrid method for 3 dimensional stress distributions of O-ring under uniform squeeze and internal pressure were developed in this research. Photoelastic experimental procedures for 3 dimensional stress distributions of O-ring under those loadings were introduced. Stress distributions of O-ring under those loadings were analyzed by photoelastic experimental hybrid method developed in this research. Von Mises equivalent stresses at arbitrary point of O-ring under those loadings were analyzed.