Abstract

The oriented graphene could construct an effective heat transfer path in composites with low filler loading. However, electrical conductivity and hygroscopicity caused by functionalized graphene has been ignored, which would decay the lifetime of power devices with the composites as thermal managing materials. In this work, SiC nanowires with high thermal conductivity and hydrophobicity were introduced into vertically oriented multilayer graphene in epoxy resin, constructing an effectively thermally conductive structure. In the structure, multilayer graphene coated with magnetic iron oxide particles responded to external magnetic field, which dramatically reduced the multilayer graphene loading in epoxy resin. When the fillers were rearranged by the magnetic field, the thermal conductivity of the composites reached 0.708 W/(mK), an enhancement of 311.6% compared to epoxy resin. Furthermore, SiC nanowires also damped the electrical conductivity (1.54 × 10−13 S/cm) and hygroscopicity of epoxy composites. The design made it possible for the composites to be applied to electronic packaging field.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.