Abstract
Novel materials and printing technologies can enable rapid and low cost prototyping and manufacturing of electronic devices with increased flexibility and complexity. However, robust and on-demand printing of circuits will require accurate metrology methods that can measure micron level patterns to verify proper production. This paper presents an evaluation of a range of optical gaging tools ranging from confocal to area 3D systems to determine metrological capability for a range of key parameters from trace thickness to solder paste volumes. Finally, this paper will present a select set of optimized measurement tools detailing both capabilities and gaps in the available technologies needed to fully realize the potential of printed electronics.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
