Abstract
Abstract A detailed computational fluid dynamic based thermal model and simulation of exposed pad SOIC package on PCB is developed with Nano and gold-based material to characterize the thermal behavior or cooling capability of the package. Achieving lower thermal resistance of electronic packaging is one of the important points of interest in electronic application. In this paper, exposed small outline IC package on PCB is compared with different composition of Au-Sn die attach materials and Nano-foil preform material to understand the thermal behavior of the package which will provide cooling through low thermal resistance between junction-to-case. Thermal reliability of electronic packaging depends on the package design and selection of materials. Package material design plays an important role in thermal management of the product. Nano-based package material can be a good choice to improve the thermal performance of system on package. Developed a 3 D model of exposed small outline IC (E-SOIC) package on a printed circuit board (PCB). Au-Sn solder paste is used as die attach material and Nano-Foil preform is used to develop the system on package (SOP) model of exposed pad SOIC package on PWB. Different types of composition of Au-Sn solder paste, such as 78Au22Sn and 80Au20Sn are considered for die attach purpose. The reason for choosing the AuSn solder paste is good reliability and performance. Au-Sn has higher thermal conductivity than other solder materials, such as Pb-free solder paste, 96.5Sn3.5Ag and leaded solder paste, 37Pb63Sn. Two types of thermal model developed to compare the package material and design of the different die attach materials and Nano-Foil preforms. In this paper simulation and data analysis will show how the optimum thermal management depends on the material selection and design of the system on package (SOP). Surface mount type SOIC package with exposed pad design is selected to enhance the thermal purpose. Gold-tin and Nano-Foil preform will be used as alternative of lead-free package materials.
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