Three-dimensional Numerical Analysis of a Joint Bonded Reinforced with Silica Nanoparticles (SiO2)

Noureddine Djebbar Noureddine Djebbar,Benali Boutabout Benali Boutabout,Rachid Hadj Boulenouar Rachid Hadj Boulenouar

doi:10.3221/igf-esis.52.11

Noureddine Djebbar Noureddine Djebbar, Benali Boutabout Benali Boutabout + Show 1 more

Open Access

https://doi.org/10.3221/igf-esis.52.11

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Abstract

Nanostructured adhesives may be defined as those materials whose elements imbedded in an epoxy matrix have dimensions in the 1 to 100 nm range. One of the most interesting aspects of ceramic nanoparticles is that their mechanical properties depend strongly upon the particle size and shape. Silica nanoparticles (SiO2) have different physical and mechanical properties from bulk ceramics. The aim of the present study is to investigate the effect of the nanoparticles rate on the equivalent stress, peeling stress and shear stress as well as the strains developed in the adhesive joint. Three-dimensional finite element models of adhesive joint were developed to determine the stress intensity as well as strain with different nanoparticles rate in the epoxy resin. Dispersion of nanoparticles with different percent in the epoxy resin allows for reinforcing the adhesive. Polymer embedded silica nanoparticles (SiO2) proved to be highly effective.

Highlights

T here is an increasing interest in polymer/silica nanocomposites for the developments of new materials with improved thermal and mechanical properties [1,2,3]
Several parameters have been highlighted such as the stiffness of the nanostructured adhesive and their size, in order to see the effect of the silica nanoparticles' dispersion imbedded in the epoxy resin on the charge transferred in the adhesive layer
I n this work, the Abaqus calculation code is used to model the simple overlap joint, which is composed of two 2024 aluminum substrates and the epoxy resin loaded with nano-silica particles

Summary

Introduction

T here is an increasing interest in polymer/silica nanocomposites for the developments of new materials with improved thermal and mechanical properties [1,2,3]. The incorporation of a small fraction of nanoparticles into a polymer matrix leads to dramatically reinforced mechanical properties [4], and endows the material with flame-retardant [5, 6], conductivity [7, 8], gas-barrier [9], and optical properties [10, 11], among others. The epoxy resin is a rigid polymer with good chemical stability, mechanical and electrical properties It is widely used as a matrix of composite materials reinforced by fillers and as adhesives [21, 22]. The epoxy is amorphous and highly cross-linked (i.e. thermosetting polymers) This microstructure provides many useful properties for engineering applications, such as a modulus of elasticity, high and failure resistance, low creep, and good performance at high temperatures [23]. Several parameters have been highlighted such as the stiffness of the nanostructured adhesive and their size, in order to see the effect of the silica nanoparticles' dispersion imbedded in the epoxy resin on the charge transferred in the adhesive layer

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