Three-dimensional monolithic integration in flexible printed organic transistors

Jimin Kwon,Yasunori Takeda,Rei Shiwaku,Shizuo Tokito,Sungjune Jung,Kilwon Cho

doi:10.1038/s41467-018-07904-5

Jimin Kwon, Yasunori Takeda + Show 4 more

Open Access

https://doi.org/10.1038/s41467-018-07904-5

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Abstract

Direct printing of thin-film transistors has enormous potential for ubiquitous and lightweight wearable electronic applications. However, advances in printed integrated circuits remain very rare. Here we present a three-dimensional (3D) integration approach to achieve technology scaling in printed transistor density, analogous to Moore’s law driven by lithography, as well as enhancing device performance. To provide a proof of principle for the approach, we demonstrate the scalable 3D integration of dual-gate organic transistors on plastic foil by printing with high yield, uniformity, and year-long stability. In addition, the 3D stacking of three complementary transistors enables us to propose a programmable 3D logic array as a new route to design printed flexible digital circuitry essential for the emerging applications. The 3D monolithic integration strategy demonstrated here is applicable to other emerging printable materials, such as carbon nanotubes, oxide semiconductors and 2D semiconducting materials.

Highlights

Direct printing of thin-film transistors has enormous potential for ubiquitous and lightweight wearable electronic applications
We explored the dynamic operation of the 3Dintegrated complementary dual-gate transistors by fabricating a 7-stage ring oscillator
The 3D monolithic integration is a promising strategy for achieving technology scaling while enhancing device performance in flexible printed transistors

Summary

Introduction

Direct printing of thin-film transistors has enormous potential for ubiquitous and lightweight wearable electronic applications. 1234567890():,; Direct printing of thin-film transistors on plastic foil has been shown to be a highly promising technology for fabricating ubiquitous and lightweight wearable electronic applications[1]. The potential of this additive manufacturing technique for low-cost mass production, rapid prototyping of small series, and low-temperature fabrication on flexible substrates renders it an attractive alternative to conventional fabrication methods for electronics[2,3]. IC applications beyond displays are requiring technology scaling to increase transistor density, which is analogue to the Moore’s law

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