Abstract
AbstractIn the last decades micro‐ and nanotechnology have made enormous progress. One of the key success factors is the continuous improvement of lithographic techniques which are the driving forces of innovation in many industrial areas. So far, lithography on the sub‐micrometer scale has mostly been limited to planar objects. Trends towards further miniaturization and high‐density integration call for disruptive developments of production standards. The next logical step is to go from planar two‐dimensional lithography to the third dimension.
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