Abstract
The stress distributions induced by an applied stress σ0 in five bonded plate specimens (silicon nitride to copper) with different thicknesses were calculated by using the three-dimensional (3-D) finite element method (FEM) stress analysis and the results were compared with those of the two-dimensional (2-D) FEM stress analysis. Along the center line perpendicular to the interface on the surface of the specimen, a maximum stress of approximately 1.3σ0 calculated with the 3-D FEM appeared in the interfacial region in silicon nitride, with a minimum stress of 0.9σ0 appearing in copper ; these values were almost independent of the thickness of the specimen. On the other hand, the 2-D FEM predicted only slight change in the stress in the interfacial region, giving a value close to the applied stress σ0. As the thickness of the specimen decreased, the maximum stress decreased more rapidly, and the stress value agreed more closely with the value calculated by the 2-D FEM at a point farther from the interface.
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