Abstract
By using optical lithographic procedures, the authors present a micromachined platform for large scale three dimensional (3D) assembly of gold nanoparticles with diameters of ∼50nm. The gold nanoparticles are formed into 3D low resistance bridges (two terminal resistance of ∼40Ω) interconnecting the two microelectrodes using ac dielectrophoresis. The thickness of the parylene interlevel dielectric can be adjusted to vary the height of the 3D platform for meeting different application requirements. This research represents a step towards realizing high density, three dimensional structures and devices for applications such as nanosensors, vertical integration of nanosystems, and characterization of nanomaterials.
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