Abstract
Abstract In this paper high resolution X-ray tomography was used to characterize reflow porosity in Sn–3.9Ag–0.7Cu/Cu solder joints. The combination of two segmentation techniques was applied for the three-dimensional (3D) visualization of pores in the joints and the quantification on the characteristics of reflow porosity, including pore size, volume fraction and morphology. The size, morphology and distribution of porosity were visualized in 3D for three different solder joints. Since the results are relatively similar for all three, only the results of one joint are presented. Solder reflow porosity was mostly spherical, segregated along the solder/Cu interface, and had an average pore size of 30 μm in diameter. A few large pores (larger than 100 μm in diameter) were present, some of which had lower sphericity, i.e., they were more irregular. The presence of these large pores may significantly influence the mechanical behavior of solder joints.
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