Thin-Film layers with interfaces that reduce RF losses on High-Resistivity silicon substrates

Abstract

Radio-Frequency (RF) losses on High-Resistivity Silicon (HRS) substrates were studied for several different surface passivation layers comprising thin-films of SiC, SiN and SiO 2 In many combinations, losses from conductive surface channels were reduced and increasing the number of interfaces between thin-films was found to be beneficial. In some cases the surface losses were completely eliminated. For example, with plasma-enhanced chemical-vapor deposition (PECVD) α-SiC layers up to a few tens of nm thick and exposed to nitridation or SiN growth at 850°C to form a SiC:N interface layer, values for the total losses of 1.6 dB/cm were achieved. Analysis of these layers was performed by using temperature dependent measurements of the RF losses on Coplanar Waveguides (CPWs), the capacitance-voltage characteristics and the sheet resistance along the Si surface. The overall results can be explained by assuming that the thin-films are so defected that they allow vertical current paths to highly-resistive interface layers where both fixed and mobile charge can be stored.