Abstract

Thin wafer handling and processing is performed by temporary bonding to a rigid carrier wafer. The rigid carrier wafer gives mechanical support during wafer thinning and backside processing. Finally the thin wafer is debonded from the carrier wafer and attached to a dicing tape on film frame. While this technology has been demonstrated for a couple of years now in pilot line and small volume, it is an entirely different story to transfer such a technology to high volume manufacturing (HVM).

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