Abstract

AbstractThis paper explores the possibility of producing amorphous and nanocrystalline silicon using very high frequency PECVD at a low substrate temperature of 123 °C at high deposition rate of 0.4‐0.7 nm/s. The quality of these amorphous layers remains similar to that obtained in layers deposited at low deposition rate of 0.1 nm/s. The amorphous‐to‐nanocrystalline transition is sensitive to deposition chamber history. The microstructure parameter of the best nanocrystalline layers amounts to 0.4. (© 2010 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)

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