Thin film power components with nanoscale electrodes and conformal dielectrics

Abstract

Achieving high capacitance densities with capacitors integrated in thin film form has been a major challenge for the past few decades. Nanocapacitors utilizing nanostructured electrodes and conformal nanodielectrics provide unique opportunities to enhance capacitance volumetric efficiency by 5–10X compared to the state-of-the-art tantalum capacitors. This paper reports the first proof-of-concept demonstration of a novel silicon-compatible high-density capacitor technology. The key novelty stems from the tremendous enhancement in surface area from porous copper nanoelectrodes and conformal alumina dielectric on such nanoelectrodes. Alternative organic package compatible high-density capacitors using etched foils is also presented. Both approaches show substantial improvements in capacitance densities compared to traditional integrated thin film or trench capacitors.