Abstract
This paper reports a technique to fabricate thin-film patterns on polymeric substrates. Wet and dry transfer stamping processes are developed for different ink materials. In addition to photoresist, organic conductive polymers are also used as the ink, to be transferred onto a PMMA substrate using the proposed transfer stamping process. The parameters of the transfer stamping process, including pressure, temperature and ink properties, are studied in this paper. Dual-layer patterns have been successfully fabricated, demonstrating the capacity of transfer stamping to fabricate multi-layer components, such as organic thin-film transistor (OTFT). The patterns are also transferred on the metal substrate, which has the potential to be used as an etch mask in the photolithography process, indicating the application of fabricating metal mold with microstructures using a simplified process.
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