Abstract
A method of thermal-isolation-assisted selective laser ablation was experimentally investigated. The experimental results demonstrated that selective laser ablation can be achieved by thermally isolating the surface material from the substrate with a patterned low-thermal-conductivity interlayer. The film deposited in the region where it was thermally isolated by the interlayer was found to be preferentially ablated whereas the film directly deposited on the substrate was unaffected. Based on this mechanism, a novel laser lift-off technique was developed.
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