Abstract
Low energy Li + ion scattering with a combination of LEED has been used to study thin Pt films on Cu(111) deposited at room temperature (≤ 50°C) and subsequently heated. At room temperature, Pt grew epitaxially on Cu(111) in the regular fcc stacking sequence for a thickness of at least five monolayers. For the annealing temperature of ∼ 300°C, PtCu intermixing was observed, forming a metastable Cu 3Pt surface alloy. Analysis of the surface layers was made by analysing the incident angle dependence associated with shadowing effects and comparison to the results obtained from a bulk Cu 3Pt(111) single crystal, revealing that the alloy is Cu 3Pt(111) phase over at least three atomic layers. Neither CuPt(111) nor CuPt 3(111) surface phase has been evidenced in this study.
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