Thin EFG octagons

Abstract

We describe here the technical improvements demonstrated under the PVMaT program as of 1/94 for the manufacture of wafers, cells and modules based on multicrystalline silicon octagons produced by the Edge‐defined Film‐fed Growth (EFG) technique. Many of these advances are now integrated into the EFG manufacturing line, and EFG technology at ASE Americas has become the first crystalline silicon photovoltaic technology other than conventional single crystal Czochralski or cast ingots to enter a full scale manufacturing phase of operations. The PVMaT work contributed a direct manufacturing cost reduction of 13% for EFG wafers and 5% for modules. Additional technology improvements were demonstrated on an R&D level, and are ready to be introduced into manufacturing. The overall cost reduction for all improvements that may be realized from the PVMaT work is 35% for EFG wafers and 14% for modules.