Abstract
Thin cellulose films on silicon substrates are used as a model system for paper fiber bonds. The films are formed by spincoating trimethylsilylcellulose on the substrates. The films are regenerated using HCl gas. After swelling in water, two samples can be bonded like a sandwich. It is shown that this model system can be used to measure the bond strength between the two films under controlled conditions. For a detailed characterization the films are studied in terms of roughness with atomic force microscopy (AFM). The hardness of the films is investigated by AFM-based nanoindentation. The chemistry and the thickness of the films is studied by infrared spectroscopy. It is shown that this model system enables the evaluation of different bonding mechanisms discussed in pulp and paper research. Our results clearly indicate that Coulomb interaction is an important bonding mechanism.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
