Thickness–stress relations in aluminum thin films

Abstract

The physical properties of aluminum thin films depend strongly on their microstructure, which can be characterized using different techniques. In the present work, aluminum thin films—grown with different thickness on silicon substrates—were analyzed by atomic force microscopy (AFM) and grazing incidence x-ray techniques. The AFM was used as a high-resolution profilemeter for measuring edge angles, step heights, surface microstructure, and roughness. The structural properties (such as crystallographic orientation, crystallite size, and phase identification) were analyzed by grazing incidence x-ray diffraction. For small thickness, AFM images show small nucleation sites because of the short time of growth. Grain size grows as the thickness increases, and film morphology seems to be uniform with large grains. The AFM results of as-grown films show a linear increase in roughness along with thickness. Roughness values decrease with aging time after film preparation, until a constant value is observed. All films mainly have (111) orientation, and its intensity grows with film thickness, with respect to the (200) and (220) peaks. As the film thickness increases, the surface stress decreases.