Abstract

We analyze exponential lateral-thickness variations observed in the growth of GaP on (001) GaAs, thermally generated SiO2, (001) Si, and nanoscopically roughened Si surfaces by organometallic chemical vapor deposition, using as a reference the polycrystalline GaP deposited on the Mo susceptor surrounding the 2in. wafers. We find these variations to be due to differences in the chemical reactivities of the various surfaces toward the generation of a precursor, probably a H–P=Ga–CH3 dimer adduct, by heterogeneous catalysis followed by desorption and diffusion through the gas phase.

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